NextFlex, the Department of Defense (DoD)-sponsored manufacturing innovation institute, has announced Project Call 10.0 (PC 10.0), its latest initiative to support the development and adoption of hybrid electronics. The initiative is expected to exceed $10 million in total project value, including both NextFlex investments and performer cost share, bringing total investments in hybrid electronics advancement to more than $165 million since NextFlex’s inception.
One of the primary focuses of PC 10.0 is artificial intelligence (AI) and machine learning (ML) applications in hybrid electronics manufacturing, emphasizing the role AI could play in optimizing design processes, automating manufacturing workflows, and improving component qualification.
NextFlex officials stated that integrating AI into hybrid electronics manufacturing could help reduce production time and costs while increasing reliability. AI applications under consideration include predictive maintenance, automated defect detection using computer vision, and AI-driven additive manufacturing processes.
PC 10.0 seeks proposals in several key areas beyond AI, including maturing hybrid electronics manufacturing processes, additive manufacturing for electronics repair, and platform demonstrators aimed at reducing life cycle costs and improving readiness within the defense industrial base.
NextFlex has also released updated hybrid electronics technology roadmaps developed with input from industry, academia, and government experts. These roadmaps provide insights into market trends, current technological capabilities, and key challenges in the field. They are expected to shape the direction of future projects and funding priorities.
Proposals for PC 10.0 are due by May 21.
